- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Patent holdings for IPC class H05K 3/06
Total number of patents in this class: 1407
10-year publication summary
139
|
130
|
147
|
131
|
142
|
119
|
117
|
143
|
81
|
19
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
FUJIFILM Corporation | 27102 |
89 |
Hitachi Chemical Company, Ltd. | 2455 |
40 |
Avary Holding (Shenzhen) Co., Limited. | 275 |
40 |
LG Innotek Co., Ltd. | 6758 |
27 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 124 |
26 |
JX Nippon Mining & Metals Corporation | 1576 |
26 |
Unimicron Technology Corp. | 449 |
25 |
Ibiden Co., Ltd. | 1724 |
23 |
Nitto Denko Corporation | 7879 |
22 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
21 |
Asahi Kasei Kabushiki Kaisha | 2429 |
19 |
LG Chem, Ltd. | 17205 |
18 |
International Business Machines Corporation | 60644 |
17 |
Resonac Corporation | 2233 |
16 |
3m Innovative Properties Company | 18406 |
15 |
Boe Technology Group Co., Ltd. | 35384 |
15 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
15 |
MEC Company Ltd. | 76 |
15 |
Mitsubishi Gas Chemical Company, Inc. | 3188 |
14 |
Murata Manufacturing Co., Ltd. | 22355 |
13 |
Other owners | 911 |